Comparison of dell r750 vs r760
The following table shows the comparison of dell r750 vs r760.
Features comparison
Features | PowerEdge R760 | PowerEdge R750 |
Processors | 2 x 4th Gen Intel® Xeon® Scalable Processors | 2 x 3rd Generation Intel® Xeon® Processor Scalable Family |
CPU interconnect | Intel Ultra Path Interconnect (UPI) | Intel Ultra Path Interconnect (UPI) |
Memory | ● 32 x DDR5 RDIMM ● Up to 4800 MT/s (1 DPC) / 4400 MT/s (2 DPC) | ● 32 x DDR4 RDIMM, LRDIMM ● 16 x PMem ( Intel Optane Persistent Memory 200 Series) |
Storage Controllers | ● PERC 11G: H755, H755N, H355 ● PERC 12G: H965i ● HBA 11: HBA355i, HBA355e ● BOSS- N1 ● Software RAID: S160 | ● PERC 10G: H345, H745, H840 ● PERC 11G: H755, H755N, H355 ● HBA 11: HBA355i, HBA355e ● BOSS-S1 adapter ● BOSS-S2 ● Software RAID: S150 |
Drive Bays | Front bays: ● 3.5 inches, 2.5 inches - 24Gb SAS, 6Gb SATA ● 2.5 inches - Gen3/4 NVMe Rear bay: ● 2.5 inches - 24Gb SAS, 6Gb SATA, Gen3/4 NVMe | Front bays: ● 3.5 inches, 2.5 inches - 12Gb SAS, 6Gb SATA ● 2.5 inches - Gen3/4 NVMe Rear bay: ● 2.5 inches - 12Gb SAS, 6Gb SATA, Gen3/4 NVMe |
Power Supplies | ● AC (Platinum): 800 W, 1400 W, 2400 W ● AC (Titanium): 700 W, 1100 W, 1800 W, 2800 W ● LVDC @-48VDC Input: 1100 W | ● AC (Platinum): 800 W, 1400 W, 2400 W ● AC (Titanium): 700 W, 1100 W ● LVDC @-48VDC Input: 1100 W |
Cooling Options | ● Air Cooling ● Optional Direct Liquid Cooling (DLC) | ● Air Cooling ● Optional Direct Liquid Cooling (DLC) |
NOTE: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate . | NOTE: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate . | |
Fans | Standard (STD) fans /High performance Silver (HPR) fans/ High performance Gold (VHP) fans | Standard (STD) fans /High performance Silver (HPR) fans/ High performance Gold (VHP) fans |
Up to six hot swap fans | Up to six hot swap fans | |
Dimension | Height: 86.8 mm (3 .41 inches) | Height: 86.8 mm (3 .41 inches) |
Width: 482 mm (18 .97 inches) | Width: 482 mm (18 .97 inches) | |
Depth: 772.13 mm (30 .39 inches) with bezel | Depth: 772.13 mm (30 .39 inches) with bezel | |
758.29 mm (29 .85 inches) without bezel | 758.29 mm (29 .85 inches) without bezel |
Features | PowerEdge R760 | PowerEdge R750 | ||
Form Factor | 2U rack server | 2U rack server | ||
Embedded Management | ● iDRAC9 ● iDRAC Direct ● iDRAC RESTful with Redfish ● iDRAC Service Manual ● Quick Sync 2 wireless module | ● iDRAC9 ● iDRAC Direct ● iDRAC Service Module ● Quick Sync 2 wireless module | ||
Bezel | Optional LCD bezel or security bezel | Optional LCD bezel or security bezel | ||
OpenManage Software | ● CloudIQ for PowerEdge plug in ● OpenManage Enterprise ● OpenManage Enterprise Integration for VMware vCenter ● OpenManage Integration for Microsoft System Center ● OpenManage Integration with Windows Admin Center ● OpenManage Power Manager plugin ● OpenManage Service plugin ● OpenManage Update Manager plugin | ● OpenManage Enterprise ● OpenManage Power Manager plugin ● OpenManage SupportAssist plugin ● OpenManage Update Manager plugin | ||
Mobility | OpenManage Mobile | OpenManage Mobile | ||
Integrations and Connections | OpenManage Integrations ● BMC TrueSight ● Microsoft System Center ● OpenManage Integration with ServiceNow ● Red Hat Ansible Modules ● Terraform Providers ● VMware vCenter and vRealize Operations Manager | OpenManage Integrations ● BMC TrueSight ● Microsoft System Center ● Red Hat Ansible Modules ● VMware vCenter | ● IBM Tivoli Netcool/ OMNIbus ● IBM Tivoli Network Manager IP Edition ● Micro Focus Operations Manager ● Nagios Core ● Nagios XI | |
Security | ● Cryptographically signed firmware ● Secure Boot ● Secure Erase ● Silicon Root of Trust ● System Lockdown (requires iDRAC9 Enterprise or Datacenter) ● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ ● Secured Component Verification (Hardware integrity check) ● Data at Rest Encryption (SEDs with local or external key mgmt) | ● Cryptographically signed firmware ● Secure Boot ● Secure Erase ● Silicon Root of Trust ● System Lockdown (requires iDRAC9 Enterprise or Datacenter) ● TPM 1 .2/2 .0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | ||
Embedded NIC | 2 x 1 GbE LOM (optional) | 2 x 1 GbE LOM | ||
Networking Options | OCP x8 (optional) Mezz 3.0 NOTE: The system allows either LOM card or an OCP card or both to be installed in the system . | OCP x8 Mezz 3.0 | ||
GPU Options | Up to two double wide 350 W, or six single wide 75 W accelerators | Up to two double wide 300 W, or eight single wide 75 W accelerators | ||
Ports | Front Ports ● 1 x USB 2.0 ● 1 x USB 3.0 ● 1 x iDRAC Direct (Micro-AB USB) port | Rear Ports ● 1 x USB 2.0 ● 1 x Dedicated iDRAC Ethernet port ● 1 x USB 3.0 ● 1 x Serial port (optional) ● 1 x VGA(optional for Direct Lliquid Cooling configuration) | Front Ports ● 1 x USB 2.0 ● 1 x USB 3.0 ● 1 x iDRAC Direct (Micro-AB USB) port | Rear Ports ● 1 x USB 2.0 ● 1 x Dedicated iDRAC Ethernet port ● 1 xUSB3.0 ● 1 xSerial port (optional) ● 1 xVGA (optional for Direct Liquid Cooling configuration) |
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